Besides a ground-fault return path, bonding within the equipment-grounding system, as well as the bonding grid of all the conductive surfaces within a building interconnected with the electrical power distribution system equipment-grounding system, provides a means to dissipate __________________________ that is generated by the many processes in manufacturing, as well as the many piping systems that are also installed in a building or other structure.
A) either static electricity or dynamic electricity
B) static electricity
C) dynamic electricity
D) none of the answers
Show Answer
Answer:B
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