Besides a ground-fault return path, bonding within the equipment-grounding system, (as well as the bonding grid of all the conductive surfaces within a building interconnected with the electrical power distribution system equipment-grounding system,), provides a means to dissipate __________ electricity that is generated by the many processes in manufacturing, as well as the many piping
systems that are also installed in a building or other structure.
A) dynamic
B) static
C) either static or dynamic
Show Answer
Answer:B
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