The need for bonding wires has been eliminated by which of the following production techniques?
A. LSI
B. Beam lead
C. Flip chip
D. Both B and C above
Show Answer
Answer: D
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The need for bonding wires has been eliminated by which of the following production techniques?
A. LSI
B. Beam lead
C. Flip chip
D. Both B and C above
Answer: D
Share your understanding of this question with the correct explanation.